300W Hot air rework station with automatic cooling system. LED digital display, showing current temperature and status. MCU confirms fast heat up, accurate and stable control on temperature. Temperature Range of 100-500°C. Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA. Includes three nozzles.
• 300W Hot air rework station with automatic cooling system. • LED digital display, showing current temperature and status. • MCU confirms fast heat up, accurate and stable control on temperature. • Temperature range: 100-500°C. • Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA. • Includes three nozzles.
